Stacked fin pack with 6pcs Φ6mm heatpipes by interface fit to enhance the heat conductivity, TDP is up to 240W.
45*45mm nickel plated big copper base with re-flow soldering. Mirror polished base contacts the CPU completely to get better thermal conductivity.
Fin pack includes 54pcs 0.4mm thickness fins which is around 789800mm2 surface area,full nickel-plating finish against the oxidation. Zipper fin technology improves
12CM blue LED fan with unique airflow-optimized fan blade design and 65CFM air volume. Pulse width modulation (PWM) allows to vary the fan speed intelligently, the maximum noise is only 26.5dBA at the maximum fan speed. Fulfill the requirements of silence and performance both.
Maximum Air Flow
Top fin with black electrophoresis to get enhanced haptics.
Metal mounting kits support INTEL and AMD platforms universally and get easy installation
Well-designed tower to be compatible with the mainstream motherboards and supports 4pcs RAM installation, no keep-out with RAM cover.