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3D

When choosing cooling, case and power products, consider CPU power, case space, noise and budget. This guide covers key points by category.

1. Air Coolers

  • TDP: rated TDP should be ≥ CPU TDP with 30% headroom.
  • Heatpipes & fins: 6+ heatpipes and dense, well-soldered fins perform better.
  • Height: must be ≤ the case CPU cooler clearance.
  • Mounting: support for current and future CPU sockets.

2. AIO Liquid Coolers

  • Radiator size: 240mm for mid-high end, 360mm for flagship/overclocking - check case support.
  • Pump & block: ceramic-bearing pumps are quieter and more durable; blocks with screens show temps.
  • Fans: ARGB looks great; balance RPM and noise.
  • Warranty: prefer 3+ years with leakage coverage.

3. PC Cases

  • Compatibility: motherboard form factor, GPU length, CPU cooler height, PSU length limits.
  • Airflow: front-in/rear-out standard; more fan mounts = more expandability.
  • Build: steel ≥0.6mm is sturdier; tempered glass for side panels.
  • Cable management: ≥25mm rear clearance eases routing.

4. Power Supplies (PSU)

  • Wattage: (CPU + GPU TDP) × 1.5, with upgrade headroom.
  • Efficiency: 80Plus Gold or higher saves power.
  • Modular: full-modular for clean routing, semi-modular for value.
  • Protection: OVP/UVP/SCP/OPP/OTP safeguards are essential.

5. Fans

  • Size: 120mm is universal; 140mm moves more air more quietly.
  • Airflow vs pressure: CFM for case cooling, mmH2O for radiators/obstructions.
  • Bearing: FDB bearings are quiet and durable.
  • Connector: 3-pin 5V for ARGB, 4-pin 12V for RGB - never mix them up.